2019There are 2281 products.

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  IEC 62951-5 Ed. 1.0 b:2019

  IEC 62951-5 Ed. 1.0 b:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

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  IEC 62951-7 Ed. 1.0 b:2019

  IEC 62951-7 Ed. 1.0 b:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

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  IEC 62148-21 Ed. 1.0 b:2019

  IEC 62148-21 Ed. 1.0 b:2019 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid...

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  IEC 62228-3 Ed. 1.0 b:2019

  IEC 62228-3 Ed. 1.0 b:2019 Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers standard by International Electrotechnical Commission, 03/11/2019 ...

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  IEC 62909-2 Ed. 1.0 b:2019

  IEC 62909-2 Ed. 1.0 b:2019 Bi-directional grid-connected power converters - Part 2: Interface of GCPC and distributed energy resources standard by International Electrotechnical...

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  IEC 62966-1 Ed. 1.0 b:2019

  IEC 62966-1 Ed. 1.0 b:2019 Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements standard by

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  IEC 60749-17 Ed. 2.0 b:2019

  IEC 60749-17 Ed. 2.0 b:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation standard by International Electrotechnical Commission,...

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  IEC 61784-2 Ed. 4.0 en:2019

  IEC 61784-2 Ed. 4.0 en:2019 Industrial communication networks - Profiles - Part 2: Additional fieldbus profiles for real-time networks based on ISO/IEC 8802-3 standard by International...

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  IEC 62047-31 Ed. 1.0 en:2019

  IEC 62047-31 Ed. 1.0 en:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials standard by

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  IEC 62047-33 Ed. 1.0 en:2019

  IEC 62047-33 Ed. 1.0 en:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device standard by International Electrotechnical...

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