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IEC 61189-2-804 Ed. 1.0 b:2023

IEC 61189-2-804 Ed. 1.0 b:2023

IEC 61189-2-804 Ed. 1.0 b:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

standard byInternational Electrotechnical Commission , 08/01/2023

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This part of IEC 61189 specifies a test method to determine the time to delamination of base
materials and printed boards using a thermomechanical analyser (TMA). Temperatures used
for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

Product Details

Edition:

1.0

Published:

08/01/2023

ISBN(s):

9782832274224

Number of Pages:

20

File Size:

1 file , 702 Bytes

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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