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IEC 63378-2-1 Ed. 1.0 en:2024

IEC 63378-2-1 Ed. 1.0 en:2024

IEC 63378-2-1 Ed. 1.0 en:2024 Thermal standardization on semiconductor packages – Part 2-1: 3D thermal simulation models of semiconductor packages for steadystate analysis – Discrete packages

standard byInternational Electrotechnical Commission , 10/01/2024

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This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.

This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

Product Details

Edition:

1.0

Published:

10/01/2024

ISBN(s):

9782832298169

Number of Pages:

20

File Size:

1 file , 1 Byte

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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