IEC 63251 Ed. 1.0 b:2023
IEC 63251 Ed. 1.0 b:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stressstandard by International Electrotechnical Commission , 11/01/2023
standard by International Electrotechnical Commission , 11/01/2023
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.