IEC 62769-8 Ed. 1.0 b:2023
IEC 62769-8 Ed. 1.0 b:2023 Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping
standard by International Electrotechnical Commission , 04/01/2023
Full Description
This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Cart
(empty)
New products
- IEC 62908-12-10 Ed. 2.0 en:2023
- IEC 62471-7 Ed. 1.0 b:2023
- IEC 62087-3 Ed. 2.0 b:2023
- IEC 61970-SER Ed. 1.0 b:2023
- IEC 60332-SER Ed. 1.0 b:2023
- IEC 61158-5-4 Ed. 4.0 b:2023
- IEC 61784-1-3 Ed. 1.0 b:2023
- IEC 61784-1-0 Ed. 1.0 b:2023
- IEC 62769-150-1 Ed. 2.0 b:2023
- IEC 61784-2-21 Ed. 1.0 b:2023
- IEC 63171-7 Ed. 1.0 en:2023
- IEC 63474 Ed. 1.0 b:2023
- IEC 60534-1 Ed. 4.0 b:2023
- IEC 62106-6 Ed. 2.0 en:2023
- IEC 60071-2 Ed. 5.0 b:2023
- IEC 60601-2-46 Ed. 4.0 b:2023
- IEC 61156-11 Ed. 2.0 en:2023
- IEC 61189-2-801 Ed. 1.0 b:2023
- IEC 61189-2-803 Ed. 1.0 b:2023
- IEC 61340-2-3 Ed. 2.0 b Cor.1:2023
Specials
-
-
AS/NZS 3580.9.15:2014
$78.00 (-56%) $34.32