Full Description

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 mDF (85 mDC), but usage is not limited to such applications.

Product Details

Published: 07/20/2009File Size: 1 file , 82 KB